| I. INTRODUCTION |
1 |
| |
|
| II. SUMMARY |
3 |
| 2.1 General Market Trends |
3 |
| 2.2 Encapsulation Materials for Semiconductors |
5 |
| 2.3 Chip Coating Materials |
6 |
| 2.4 Organic Polymeric Materials for Chip Mounting |
8 |
| 2.5 High Density Mounting Materials |
9 |
| |
|
| III. MARKET AND INDUSTRY STATUS |
11 |
| 3.1 Japanese Electronics Industry |
11 |
| 3.1.1 Electronics Parts |
12 |
| 3.1.2 Electronic Devices |
14 |
| 3.2 Market Trend of Semiconductor Materials |
15 |
| 3.2.1 World Semiconductor Market |
15 |
| 3.2.2 Ranking of Japan in the World |
18 |
| 3.2.3 Production Status of Semiconductor Producers in
Japan |
19 |
| 3.2.4 Production of Semiconductor Encapsulation Materials
and Major Producers |
22 |
| 3.2.5 Production of Semiconductor Coating Materials and
Major Producers |
25 |
| 3.2.6 Production of Semiconductor Mounting Materials and
Major Producers |
26 |
| 3.3 Market Trends in Package Circuit Boards (PCB) for
Semiconductors |
28 |
| 3.3.1 Production Status of PCB for Semiconductors |
28 |
| 3.3.2 Growth Trend of Build-up Multi-layer Printed Circuit
Boards |
31 |
| 3.3.3 Prosperity of the Semiconductor Package Boards Market |
35 |
| 3.3.4 Road for Recovery of Japanese Boards Industry |
42 |
| 3.3.5 Situation of Laminated Board Manufacturers |
45 |
| |
|
| IV. ORGANIC POLYMERIC MATERIALS FOR SEMICONDUCTOR ENCAPSULATION |
47 |
| 4.1 Technologies for Resin Encapsulation of Semiconductors |
47 |
| 4.1.1 Characteristics Required for Encapsulation Materials |
47 |
| 4.1.2 Methods of Resin Encapsulation of Semiconductors |
47 |
| 4.1.3 Basic Properties of Resin Encapsulation Materials |
48 |
| 4.2 R&D Issues for Epoxy Resin Encapsulation Materials |
52 |
| 4.2.1 Improved Moisture Resistance |
54 |
| 4.2.2 Prevention of Soft Errors |
55 |
| 4.2.3 Reduction of Thermal Stress |
56 |
| 4.2.4 Improved Heat Reflow Soldering Resistance |
60 |
| 4.3 Development of Epoxy Resin type Encapsulation Materials
for the Ball Grid Array (BGA) |
67 |
| 4.3.1 Reducing Warpage Incurred in Single-Sided Encapsulation |
69 |
| 4.3.2 Technology Development for Improved heat Reflow
Soldering Resistance in Single-sided Encapsulation Equipment |
84 |
| 4.4 Development of Epoxy Resin Encapsulation Materials
for Chip-sized Package (CSP) |
92 |
| 4.4.1 Development of Thermal Stress Reduction Technology
for CSP Encapsulation Materials |
92 |
| 4.4.2 Technology Developments to Reduce Warpage in WL-CSP
Encapsulation Materials |
94 |
| 4.5 Development of Liquefied Epoxy Resin Encapsulation
Materials |
96 |
| 4.5.1 Necessary Characteristics of Liquefied Encapsulation
Materials and Recent Performance Improvements |
96 |
| 4.5.1 A. Improved Moisture Resistance |
97 |
| 4.5.1 B. Reduced Warpage |
100 |
| 4.5.1 C. Improved Thermal Impact Resistance |
101 |
| 4.5.1 D. Improved Cohesiveness |
102 |
| 4.5.2 Development of Underfill Material for Flip Chips |
103 |
| 4.5.3 ìGlob-Topî Materials for Wire Bonding |
111 |
| 4.5.4 Development of Encapsulation Materials for Tape
Automated Bonding (TAB) |
115 |
| 4.6 Development of Environmentally Safe Encapsulation Materials |
120 |
| 4.6.1 Development of Bromine/Antimony Free Materials |
120 |
| 4.6.2 Development of Lead-Free Soldering Encapsulation
Materials |
133 |
| |
|
| V. RECENT TRENDS IN PHOTOSENSITIVE MATERIALS FOR SEMICONDUCTOR
CHIP COATING |
141 |
| 5.1 Chip Surface Protection |
141 |
| 5.1.1 Coating Technologies for Chip Surface Protection |
141 |
| 5.1.2 Photosensitive Resins for Chip Surface Coating |
146 |
| 5.2 Polyimides for Semiconductor Chip Coating |
151 |
| 5.2.1 Negative Type Photosensitive Polyimide |
151 |
| 5.2.2 Positive Type Photosenstive Polyimide |
162 |
| 5.3 Polybenzoxazoles for Semiconductor Chip Coating |
176 |
| 5.3.1 Problems of Positive Type Photosensitive Polyimides
(PI) |
176 |
| 5.3.2 Positive Type Photosensitive Polybenzoxazoles (PBO) |
178 |
| 5.3.3 Improvement of Positive Type Photosensitive PBO |
183 |
| 5.3.4 Development of a Negative Type Photosensitive PBO |
194 |
| 5.4 Interlayer Insulation Film Materials for Semiconductors |
197 |
| 5.4.1 Interlayer Insulation Film Materials Technology
Status |
197 |
| 5.4.2 Development of Low Dielectric Interlayer Insulating
Film Materials |
201 |
| 5.4.3 High Thermal Resistance Low Dielectric Materials
Under Development |
203 |
| 5.5 Wiring Materials for Wafer-Level Chip-Sized Package
(WL-CSP) |
210 |
| 5.5.1 Kinds of WL-CSP and Their Characteristics |
211 |
| 5.5.2 WL-CSP of Fujitsu |
214 |
| 5.5.3 Rerouting Wiring Materials for WL-CSP |
217 |
| 5.5.4 Post Forming Materials for WL-CSP |
222 |
| |
|
| VI. ORGANIC POLYMERIC MATERIALS FOR SEMICONDUCTOR CHIP
MOUNTING |
223 |
| 6.1 Chip Mounting Materials in the Form of Paste |
223 |
| 6.1.1 Epoxy Resin Paste Chip Mounting Materials |
223 |
| 6.1.2 Polyimide Chip Mounting Materials |
239 |
| 6.1.3 Acrylic Chip Mounting Materials |
248 |
| 6.2 Film Type Chip Mounting Materials |
254 |
| 6.2.1 Development of Die Attach Film Materials |
255 |
| 6.2.2 Development of LOC Adhesive Film |
265 |
| 6.2.3 Development of Film for Flip Chip Connection |
271 |
| |
|
| VII. ORGANIC POLYMER MATERIALS FOR HIGH DENSITY MOUNTINGS |
275 |
| 7.1 Development of MCM Substrate |
275 |
| 7.1.1 MCM-L Substrate Developments |
276 |
| 7.1.2 Development of Multi-chip Module Deposited Thin
Film (MCM-D) |
277 |
| 7.2 Packaging Substrate Developments |
279 |
| 7.2.1 Development of Substrates for High Speed Semiconductor
Devices |
279 |
| 7.2.2 Development of Chip Supporting Substrate Superior
in Crack Resistance |
280 |
| 7.2.3 Development of Substrate for Wafer Scale Package |
281 |
| 7.2.4 Development of Semiconductor Package Substrate Superior
in Connection Reliability |
282 |
| 7.2.5 Development of High Thermal Resistance Semiconductor
Package Substrate |
284 |
| 7.2.6 Advanced Surface Mounting Technology and Development
of New Substrates |
287 |
| 7.3 Development of BGA Packaging Substrate |
289 |
| 7.3.1 Development of BGA Substrate Using Laser Technology |
289 |
| 7.3.2 Development of High Planarity BGA Package Substrate |
291 |
| 7.4 Development of Flip Chip Substrate |
291 |
| 7.5 Development of Film Substrate for Tape Carrier Package
(TCP) |
294 |
| 7.5.1 Development of Thin type Film Substrate |
294 |
| 7.5.2 Development of Wire Bondable Film Substrate |
296 |
| 7.6 Development of Interposer Substrate for CSP |
297 |
| 7.6.1 Substrate Materials for Interposer |
297 |
| 7.6.2 Flexible Materials for Interposer |
299 |
| 7.6.3 Adhesive Materials for Interposer Use |
300 |
| 7.7 Development of High Thermal Conductivity Substrate |
306 |
| 7.7.1 Development of High Thermal Conductivity Composite
Substrate for Power Modules |
306 |
| 7.7.2 Development of High Thermal conductivity Metal Base
Substrate |
308 |
| 7.7.3 Development of High Heat Dissipation Semiconductor
Package Substrates |
310 |
| 7.8 Development of High Dissipation Materials |
314 |
| 7.8.1 Development of Dissipation Sheet |
314 |
| 7.8.2 Development of Super Graphite Sheet |
317 |
| 7.8.3 Heat Dissipation Spacer Developments |
318 |
| 7.9 Development of Adhesive Process for Next Generation
Mounting Technology |
319 |
| 7.9.1 Electroconductive Adhesive |
319 |
| 7.9.2 Thermally Resistant Adhesives |
321 |
| 7.9.3 Photosensitive Adhesives |
322 |
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| REFERENCES |
333 |
